The Miami System on Module (SoM) is based on the Xilinx Zynq-7035/7045/7100 System on Chip (SoC). The module combines a high performance (ARM-based) application microprocessor with FPGA logic in a single chip. It integrates all system components required to bring the system alive including memory, power supply, debugging facilities and various connectivity options. It is a suitable platform for phased array ultrasound and radar applications, which require effective processing power, high speed communication and software defined radio. 275KLE, 900  DSP Blöcke, 17.6Mbit RAM, 343,800 FlipFlops, 16x10.3125Gb/s GTX tranceivers Processor System ARMCortex-A9 (Dual-Core) 2x800MHz CPU Perfomance Co-Processor 2xARM NEON 1 GB DDR3/DDR3L RAM (connected to FPGA) 1 GB DDR3/DDR3L RAM (connected to CPU) 64 MB 2xQuad SPI NOR 7 KB EEPROM (3KB secure storage, 4KB normal storage) Processor-Peripherals UART CAN I2C SPI USB 2.0 OTG 1000Mbps Ethernet 8xPCIe GEN2 SATA-3 User programmable/configurable Interfaces 49x + 47 + 48 configurable 1V8, 2V5 and 2V3 user I/O (HR) 48x configurable user I/O (HP) 28xPS controlled 1V8 I/O (MIO) 16xSATA-2/3 16x 40GB Ethernet 16x USB 3.0 16xPCIe GEN3/4 16xCoaXPress 16xHDMI Clock distribution single 15V/3A supply size 85mmx68,5mm 2 x 120 pins + 1x180 pins Samtec board-to-board interconnect + 3 pins connector for external Fan  

The Miami System on Module (SoM) is based on the Xilinx Zynq-7035/7045/7100 System on Chip (SoC). The module combines a high performance (ARM-based) application microprocessor with FPGA logic in a single chip. It integrates all system components required to bring the system alive including memory, power supply, debugging facilities and various connectivity options. It is a suitable platform for phased array ultrasound and radar applications, which require effective processing power, high speed communication and software defined radio. 444KLE, 2020 DSP Blöcke, 26.5Mbit RAM, 554,800 FlipFlops, 16x10.3125Gb/s GTX tranceivers Processor System ARMCortex-A9 (Dual-Core) 2x800MHz CPU Perfomance Co-Processor 2xARM NEON 1 GB DDR3/DDR3L RAM (connected to FPGA) 1 GB DDR3/DDR3L RAM (connected to CPU) 64 MB 2xQuad SPI NOR 7 KB EEPROM (3KB secure storage, 4KB normal storage) Processor-Peripherals UART CAN I2C SPI USB 2.0 OTG 1000Mbps Ethernet 8xPCIe GEN2 SATA-3 User programmable/configurable Interfaces 49x + 47 + 48 configurable 1V8, 2V5 and 2V3 user I/O (HR) 48x configurable user I/O (HP) 28xPS controlled 1V8 I/O (MIO) 16xSATA-2/3 16x 40GB Ethernet 16x USB 3.0 16xPCIe GEN3/4 16xCoaXPress 16xHDMI Clock distribution single 15V/3A supply size 85mmx68,5mm 2 x 120 pins + 1x180 pins Samtec board-to-board interconnect + 3 pins connector for external Fan